← 返回國際論壇講者 Synopsis
The age of LLMs has brought an insatiable need for data: AI accelerators operate right at the limit of the system memory wall. To keep up with this demand for data I/O, traditional electrical interconnects are being replaced with optical counterparts. This new optical I/O delivers high bandwidth, low latency, energy efficient and reliable data transmission, all while relying on mature CMOS-compatible processing for its fabrication.
Optical transceivers are already widely used in data centers, mostly in pluggable form factors, to enable intra-data center optic fiber links. The industry has recently adopted co-packaged optics by integrating the optical engine into the same package substrate as the host IC. The industry trend to miniaturize and co-integrate electronics and photonics has led to an explosion of power density, thermal crosstalk and general thermal management and reliability challenges.
In this talk, I will highlight some of the research activities imec’s Advances Reliability and Robustness department is working on in the field of co-packaged optics. First, a look into the multiscale thermal problem in photonic integrated circuits: from devices (μm) to packages (cm) and racks (m). Photonic devices are notoriously thermally sensitive, thus requiring innovative thermal designs to ensure high energy efficiency and thermal controllability. Secondly, Si photonics reliability will be discussed: degradation mechanisms of integrated heaters, photodiodes and lasers. Finally, mechanical aspects will be highlighted, considering deformation and wafer warpage.
Biographical Sketch
Dr. ir. ing. David Coenen is a Senior Researcher at imec, Belgium, specializing in thermal management and multi-physics modelling of integrated photonic and electronic systems. His research encompasses silicon photonics, co-packaged optics, electro-optical-thermal modelling, computational fluid dynamics, and physics-informed machine learning for next-generation semiconductor technologies. He received his Ph.D. from KU Leuven with summa cum laude and congratulations of the Board of Examiners, following Master's degrees in Electromechanical Engineering from Ghent University (summa cum laude) and Aerospace Engineering from KU Leuven. Dr. Coenen has authored numerous peer-reviewed journal and conference publications, holds multiple patents in semiconductor thermal management, and has received several prestigious awards, including the IEEE ITherm Best Paper Award, Harvey Rosten Award for Excellence, imec Ph.D. Excellence Award, Knack Young Talent Award, and the Semicon Europa 20 Under 30 Award. He actively supervises graduate researchers, contributes to engineering education at KU Leuven, and serves as a reviewer for leading international journals and conferences in thermal engineering, electronics packaging, and silicon photonics.
Presentation Language｜ English